Laser Micro-Machining Specialist – WBG Semiconductors

As a laser micro-machining specialist, you will apply your expertise to drive innovation and progress in advanced laser processing.

Key responsibilities include:

  • Perform optical alignments and laser tests.
    Apply design of experiments (DOE) to optimize technology recipes and operating parameters.
    Build and refine hardware and software systems for advanced laser experiments.
  • Lead R&D projects that pioneer new laser technologies, ensuring HiLASE remains at the forefront of cost, quality, and delivery.
    Develop clear project timelines, budgets, and milestones to keep initiatives on track.
    Compile data, prepare reports, and present results to leadership and stakeholders.
  • Guide and mentor colleagues to align teams with project goals.
    Collaborate with vendors, research institutes, and labs to validate new ideas quickly.
    Stay ahead of industry developments through conferences, publications, and professional societies.
    Communicate complex concepts in clear, accessible terms.
  • Evaluate and compare emerging technologies against competitive alternatives.
    Partner with external specialists to solve challenges in laser-material interactions, optics, and metrology.
    Tackle special projects and additional responsibilities with professionalism and adaptability.

Technical Skills (the essentials)

  • Proven record of at least 1 year experience in laser micro-machining using ultrashort pulses (fs/ps lasers).
  • Hands-on experience with laser process optimization (power, pulse overlap, scanning strategies).
  • Familiarity with laser-material interaction physics for brittle and semiconductor materials.
  • Competence in CAD/CAM software for laser machining (e.g., LaserDesk, proprietary systems).
  • Metrology and inspection: optical microscopy, SEM, profilometry for surface and edge quality assessment.

The bonus

  • Semiconductor processing knowledge (theory, wafer handling).
  • Experience with diffractive optical elements (DOE) for beam shaping.
  • Hands-on with galvo systems (Scanlab or equivalent).
  • Microscopy experience (optical, confocal or SEM).
  • Familiarity with cleanroom protocols and contamination control.

The valuable skills

  • Basic programming or scripting for automation (Python, LabVIEW).
  • Experience with high-precision positioning systems (stages, encoders).
  • Ability to work with simulation tools (COMSOL, Zemax) for optical and thermal modeling.

In return, you will get from us:

  • Interesting and varied work where you definitely won’t get bored
  • Possibility of self-realization and application of own ideas
  • Time flexibility
  • Ability to directly influence Czech and European industry, short-term feedback loop
  • Support for further education, personal development and growth
  • Opportunity to work in a unique scientific centre with an international team
  • Friendly and supportive team sharing common goal
  • A fair boss
  • Language lessons and team events
  • 5 weeks vacation, 6 personal days and other employee benefits

Do you need to know more?

The HiLASE Center focuses on the technological development of a new generation of diode-pumped lasers with a wide range of scientific and industrial applications. HiLASE helps companies solve their needs and problems in innovative ways using globally unique laser technologies.

Explore the HiLASE Center with a virtual tour:

Join us

If you think we could work well together, send me your resume and a few words about why you would like to be our new team member.
I look forward to hearing from you!

Martina

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